J. Doylend (US) Intel Corporation

Intel Corporation

Author Of 2 Presentations

 Conference Calendar
(ID) Industry Day

MG2.3 - Silicon Photonics for 5G

Presentation Type
Invited Submission
Authors
Date
09/30/2019
Time
10:30 AM - 12:00 PM
Room
La Vista D/E
Duration
30 Minutes
Lecture Time
11:30 AM - 12:00 PM
(OI) Optical Interconnects

TuH3.1 - SILICON PHOTONICS FOR 5G WIRELESS: A CWDM4 SOLUTION

Presentation Type
Invited Submission
Authors
Date
10/01/2019
Time
01:30 PM - 02:45 PM
Room
La Vista F
Duration
30 Minutes
Lecture Time
01:30 PM - 02:00 PM

Abstract

Abstract

A 100Gbps CWDM4 silicon photonics transmitter with four integrated-on-chip distributed feedback lasers operating at 20 nm wavelength spacing has been demonstrated for 5G wireless front-haul applications over a temperature range of -20°C to 95°C.

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Presenter Of 2 Presentations

 Conference Calendar
(ID) Industry Day

MG2.3 - Silicon Photonics for 5G

Presentation Type
Invited Submission
Authors
Date
09/30/2019
Time
10:30 AM - 12:00 PM
Room
La Vista D/E
Duration
30 Minutes
Lecture Time
11:30 AM - 12:00 PM
(OI) Optical Interconnects

TuH3.1 - SILICON PHOTONICS FOR 5G WIRELESS: A CWDM4 SOLUTION

Presentation Type
Invited Submission
Authors
Date
10/01/2019
Time
01:30 PM - 02:45 PM
Room
La Vista F
Duration
30 Minutes
Lecture Time
01:30 PM - 02:00 PM

Abstract

Abstract

A 100Gbps CWDM4 silicon photonics transmitter with four integrated-on-chip distributed feedback lasers operating at 20 nm wavelength spacing has been demonstrated for 5G wireless front-haul applications over a temperature range of -20°C to 95°C.

Collapse