(OI) Optical Interconnects
  • J. Doylend (US) Intel Corporation

TuH3.1 - SILICON PHOTONICS FOR 5G WIRELESS: A CWDM4 SOLUTION

Presentation Type
Invited Submission
Authors
  • J. Doylend (US) Intel Corporation
  • H. Yu (US) Intel Corporation
  • W. Lin (US) Intel Corporation
  • K. Nguyen (US) Intel Corporation
  • W. Liu (US) Intel Corporation
  • D. Gold (US) Intel Corporation
  • A. Dahal (US) Intel Corporation
  • C. Jan (US) Intel Corporation
  • R. Herrick (US) Intel Corporation
  • G. Ghiurcan (US) Intel Corporation
  • S. Hollingsworth (US) Intel Corporation
  • R. Romero (US) Intel Corporation
  • M. Favaro (US) Intel Corporation
  • L. Qiu (US) Intel Corporation
  • D. Zhu (US) Intel Corporation
  • Y. Akulova (US) Intel Corporation
Date
10/01/2019
Time
01:30 PM - 02:45 PM
Room
La Vista F
Duration
30 Minutes
Lecture Time
01:30 PM - 02:00 PM

Abstract

Abstract

A 100Gbps CWDM4 silicon photonics transmitter with four integrated-on-chip distributed feedback lasers operating at 20 nm wavelength spacing has been demonstrated for 5G wireless front-haul applications over a temperature range of -20°C to 95°C.

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