Y. Akulova (US) Intel Corporation
Intel CorporationAuthor Of 1 Presentation
(OI) Optical Interconnects
TuH3.1 - SILICON PHOTONICS FOR 5G WIRELESS: A CWDM4 SOLUTION
Presentation Type
Invited Submission
Authors
- J. Doylend (US) Intel Corporation
- H. Yu (US) Intel Corporation
- W. Lin (US) Intel Corporation
- K. Nguyen (US) Intel Corporation
- W. Liu (US) Intel Corporation
- D. Gold (US) Intel Corporation
- A. Dahal (US) Intel Corporation
- C. Jan (US) Intel Corporation
- R. Herrick (US) Intel Corporation
- G. Ghiurcan (US) Intel Corporation
- S. Hollingsworth (US) Intel Corporation
- R. Romero (US) Intel Corporation
- M. Favaro (US) Intel Corporation
- L. Qiu (US) Intel Corporation
- D. Zhu (US) Intel Corporation
- Y. Akulova (US) Intel Corporation
Date
10/01/2019
Time
01:30 PM - 02:45 PM
Room
La Vista F
Duration
30 Minutes
Lecture Time
01:30 PM - 02:00 PM
Abstract
Abstract
A 100Gbps CWDM4 silicon photonics transmitter with four integrated-on-chip distributed feedback lasers operating at 20 nm wavelength spacing has been demonstrated for 5G wireless front-haul applications over a temperature range of -20°C to 95°C.