A. Schembri (FR) CEA-LETI
CEA-LETIAuthor Of 1 Presentation
(PIP) Photonic Integration and Packaging
MD1.2 - CMOS COMPATIBLE III-V/SILICON LASER INTEGRATION ON SILICON PHOTONICS PLATFORM
Presentation Type
Contributed Submission
Authors
Date
09/30/2019
Time
08:30 AM - 10:00 AM
Room
El Mirador C West
Duration
15 Minutes
Lecture Time
08:45 AM - 09:00 AM
Abstract
Abstract
We present the hybrid III-V/Si photonic platform developed in CEA-LETI. III-V material is integrated through direct molecular bonding enabling the monolithic integration of light sources. Fabry-Perot laser reference design is used for the process validation. Layout guidelines to improve the thermal behavior are presented.