(PIP) Photonic Integration and Packaging
  • A. Jain (US) Seagate Technology

MD2.3 - CMOS COMPATIBLE OPTICAL ISOLATOR WITH TANDEM RING MODULATORS

Presentation Type
Contributed Submission
Authors
  • S. Dwivedi (BE) Imec
  • A. Jain (US) Seagate Technology
  • S. Arafin (US)
Date
09/30/2019
Time
10:30 AM - 12:00 PM
Room
El Mirador C West
Duration
15 Minutes
Lecture Time
11:15 AM - 11:30 AM

Abstract

Abstract

Integrated optical isolators have relied on bonded magnetic materials for isolation > 30dB. However, such materials are incompatible with CMOS processes. We propose a tandem ring modulators to achieve high-isolation and a small footprint. It uses plasma dispersion effect, thus achieving low-insertion loss and high-speed modulation.

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