M. Jelínek (CZ) Fac. of Nuclear Sci. and Phys. Eng.
Fac. of Nuclear Sci. and Phys. Eng.Author Of 1 Presentation
(HPIS) High Power / Intensity Sources
WC1.4 - DEVELOPMENT OF A HIGH-QUALITY EPOXY BONDING TECHNOLOGY
Presentation Type
Contributed Submission
Authors
- J. Cvrček (CZ) HiLASE Centre, Institute of Physics, Czech Academy of Sciences
- A. Eilanlou (CZ) HiLASE Centre, Institute of Physics, Czech Academy of Sciences
- M. Smrž (CZ) HiLASE Centre, Institute of Physics, Czech Academy of Sciences
- M. Jelínek (CZ) Fac. of Nuclear Sci. and Phys. Eng.
- T. Mocek (CZ) HiLASE Centre, Institute of Physics, Czech Academy of Sciences
Date
10/02/2019
Time
08:30 AM - 10:00 AM
Room
El Mirador C East
Duration
15 Minutes
Lecture Time
09:45 AM - 10:00 AM
Abstract
Abstract
In case of thin-disk gain media, heat generated is extracted via a cooled metallic heatsink through additional layer. An epoxy bonding technology developed at HiLASE center is a perfect instrument where high quality layers and good thermal conductivity are required.