Author Of 3 Presentations

PDS - Photonics for Defense Systems

TuF2.6 - “HYBRID DAC” APPROACH TO INCREASING DYNAMIC RANGE AND SIGNAL TO NOISE IN IRSP SYSTEMS.

Presentation Type
Invited Submission
Date
08/20/2019
Time
10:15 AM - 12:15 PM
Room
Pelican
Duration
15 Minutes
Lecture Time
12:00 PM - 12:15 PM

Abstract

Abstract

We propose and show preliminary test results on a system to improve dynamic range and signal to noise ratio (SNR) in an infrared (IR) light-emitting diode (LED) display system by splitting the digital-to-analog conversion between the close-support electronics (CSE) and the read-in integrated-circuit (RIIC).

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TuF3.5 - SMALL BATCH PRODUCTION AND TEST OF CUSTOM SUPPORT ELECTRONICS FOR INFRARED LED SCENE PROJECTORS

Presentation Type
Invited Submission
Date
08/20/2019
Time
01:15 PM - 03:15 PM
Room
Pelican
Duration
15 Minutes
Lecture Time
02:45 PM - 03:00 PM

Abstract

Abstract

Building an Infrared Scene Projector (IRSP) requires reliable electronics. Our Closed System Electronics (CSE) is designed to be modular and scalable to drive current and future IRSPs. This work highlights the production, performance, packaging, and hardware developments of our CSE.

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WB2.2 - FABRICATION, EVALUATION, AND IMPROVEMENTS OF 1KX1K AND 2KX2K INFRARED LED SCENE PROJECTOR SYSTEMS

Abstract

Abstract

Infrared LED Scene Projector (IRSP) system is an emerging technology that has made numerous progress in its development and testing. That progress ranges from fabrication and evaluation steps to improve the electronics as well as improvements to the 1Kx1K and 2Kx2K hybrid arrays.

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Presenter Of 1 Presentation

TuF3.5 - SMALL BATCH PRODUCTION AND TEST OF CUSTOM SUPPORT ELECTRONICS FOR INFRARED LED SCENE PROJECTORS

Presentation Type
Invited Submission
Date
08/20/2019
Time
01:15 PM - 03:15 PM
Room
Pelican
Duration
15 Minutes
Lecture Time
02:45 PM - 03:00 PM

Abstract

Abstract

Building an Infrared Scene Projector (IRSP) requires reliable electronics. Our Closed System Electronics (CSE) is designed to be modular and scalable to drive current and future IRSPs. This work highlights the production, performance, packaging, and hardware developments of our CSE.

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